Sensor & Electronics Packages

The Dietze Group provides specialized packaging solutions for sensor and electronics applications requiring hermetic feedthroughs. Our manufacturing method can achieve high precision pin positioning, enabling a superior level of miniaturization. Prominent products benefitting from our hermetic packaging technology include media separated pressure sensors and high accuracy vacuum sensors.

Selecting the appropriate material configuration, we manufacture both matched seals and compression seals depending on customer requirements. One of our major strengths is our flexibility with alternative housing materials such as Titanium.

For all sensor and electronics products, we use our in-house developed precision furnace equipment to guarantee a superior level of quality. Our high degree of vertical integration with manufacturing of fixtures, housings and pins gives us extra flexibility.

Key features:

  • Hermetic sensor packages using glass-to-metal and glass-to-ceramic sealing technology
  • Superior level of miniaturization due to high precision pin positioning
  • Wide housing material selection available (e.g. Stainless steel, Titanium, Kovar …)
  • Wide temperature range of -50 °C to 450 °C (matched seal)
  • High burst pressure up to 3000 bar (compression seal)
  • Selective plating according to customer needs (Gold, Nickel, …)
  • Wire-bondable pin surfaces
  • Helium leak rate as low as 10^-9 mbar l s^-1
  • Laser-marking service available