Sensor & Electronics Packages

The Dietze Group provides specialized packaging solutions for sensor and electronics applications requiring hermetic feedthroughs. By our manufacturing method, we can achieve a very high precision for the pin positioning. This achieves a superior level of miniaturization which enables our customers to design for higher temperatures, pressure ranges and electrical insulation levels.

Prominent products benefitting from our hermetic packaging technology include media separated pressure sensors and high accuracy vacuum sensors.

Selecting the appropriate material configuration we manufacture both matched seals and compression seals depending if low residual stress or high mechanical stability is required.

For all sensor and electronics products, we use our own in-house developed furnace equipment to guarantee a superior level of quality.

Key features:

  • Hermetic sensor packages using glass-to-metal and glass-to-ceramic sealing technology
  • Superior level of miniaturization due to high precision pin positioning
  • Wide housing material selection available (e.g. Stainless steel, Titanium, Kovar …)
  • Wide temperature range of up to -50 °C to 400 °C
  • High burst pressure of up to 3000 bar depending on design
  • Selective plating according to customer needs (Gold, Nickel, …)
  • Wire bondable pin surfaces available
  • Hermeticity (Helium) < 1*10-10 mbar*l/s
  • Laser-marking service available